A new world of possibilities for 3D moldable wood fiberboards with acForm®

acForm®, our groundbreaking dispersion-based binder for new designs, is shaping a new generation of wood-based panels. Join our expert Felix Strangfeld from BASF’s fiber bonding technical lab to see how it works on a rounded 3D shape, molded to 15mm depth.
While conventional plywood risks cracking with such a design, 3MF reliably produces high-quality results with incredible depth and surface smoothness. Step into the future and find out more about acForm® and 3D moldable wood fiberboards (3MF) at https://dispersions-resins.basf.com/emea/en/fiber-bonding/acform.html
Music: https://www.bensound.com/royalty-free-music

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